Optical Components X-ray source components
Diamond X-ray Targets
Diamond supports the layer that generates X-rays and carries heat from the beam spot.
Good to know
- In transmission designs, X-rays pass through the diamond support.
- Target metal and layer thickness shape source performance.
- The diamond, target layer and support frame must be specified as an assembly.
Specifications
What we define for diamond x-ray targets, with units and how each is typically measured. We confirm values for your application in technical review.
Request the datasheetLook up a term in the glossaryDimensions & tolerances
| Parameter | Unit | Typical test method |
|---|---|---|
| Clear aperture | mm | Optical measurement to drawing |
| Thickness and tolerance (bulk or layer) | mm | Micrometer or optical gauge |
| Lateral size, outline or diameter, and tolerance | mm | Optical measurement |
| Thickness uniformity (total thickness variation) | µm | Thickness mapping or interferometry |
| Edge condition and chip limit | Microscopy inspection to drawing |
Surface & finish
| Parameter | Unit | Typical test method |
|---|---|---|
| Surface roughness per side | nm Ra | Profilometry or AFM |
Material properties
| Parameter | Unit | Typical test method |
|---|---|---|
| Thermal conductivity grade | W/m·K | Laser flash (ASTM E1461) |
Metallization & joining
| Parameter | Unit | Typical test method |
|---|---|---|
| Metal adhesion | N | Pull or scratch test |
Optical performance
| Parameter | Unit | Typical test method |
|---|---|---|
| Coating construction and thickness | nm | Spectrophotometry, XRF or cross-section |
| Radiation type, energy range and beam size | keV | Per application brief |
Integration & packaging
| Parameter | Unit | Typical test method |
|---|---|---|
| Heat load or beam power | W | Application thermal analysis |
| Substrate, carrier or diamond form | Per drawing | |
| Operating temperature limit | °C | Per application brief |
| Certificate of conformance and traceability | Supplier declaration |
Where it is used
- Lasers & PhotonicsOptics must transmit light and survive heat load; diamond transmits and conducts heat away.
- Semiconductor EquipmentProcessing demands precision, cleanliness and compatible materials; diamond parts are specified around all three.
- Research & QuantumExperiments need pure material and sensitive measurement; diamond is specified to your conditions.
Requirement to review
Have a material requirement? Let’s review it.
Share your diamond x-ray targets requirement, dimensions and drawing for review.