Product family
Thermal Components Move heat away from the source
For engineers whose device runs too hot and who need a short path to the cooling system.
Thermal parts for your cooling path
Diamond Heat Spreaders
Draws heat from a concentrated source and spreads it toward a larger cooling interface.
Diamond Thermal Coins & Inserts
A small diamond insert that gives a package one local path for heat.
Diamond Heat Sinks
Carries heat from your device toward the cooling assembly.
Diamond Laser Submounts
Supports your laser element while giving its heat a way out.
Diamond Chip Substrates
Sits beneath a die to support it mechanically and spread its heat.
Product images are representative.
What we will ask you
Bring what you know. We confirm the details with you during technical review.
- How much heat, and where does it start?Total load, hotspot size and the footprint you have.
- What shape and thickness do you need?Outline, thickness and any inserts or cut-outs on your drawing.
- How will it attach, and to what?Joining method, mating materials and your thermal targets.
Full specification checklist for engineers
Dimensions & tolerances
- Lateral size, outline or diameter, and tolerancemm
- Thickness and tolerance (bulk or layer)mm
- Flatness or surface figure, and bowµm or fringes
- Profile, curvature or focal lengthmm
Surface & finish
- Surface roughness per sidenm Ra
Material properties
- Thermal conductivity gradeW/m·K
Metallization & joining
- Metallization or plating stack and thicknessnm per layer
- Solder or braze compatibility
- Metallization pattern and coverage
Electrical & electrochemical
- Electrical isolationΩ
Integration & packaging
- Mounting interface, host fit and attachment
- Heat load or beam powerW
- Operating load, medium and environment
Common questions
All questionsWhich thermal component should I choose?
Choose a heat spreader to move heat sideways, a heat sink to carry heat to the cooler, a submount for a laser, or a chip substrate under a die. Your heat load, geometry and cooling path decide.
Does diamond conductivity guarantee a cooler device?
No. Conductivity is a material property. Device temperature depends on the full assembly: heat load, geometry, interfaces and cooling. We review these together before agreeing a configuration.
What do you need from me to quote a thermal part?
Heat load and hotspot size, footprint and thickness, contact faces and flatness, and attachment method. Tell us if you need metallization. Values are confirmed in technical review.
Requirement to review
Have a material requirement? Let’s review it.
Share your thermal components requirement, dimensions and drawing for review.