Computing & Packaging
More intelligence.
A considered thermal path.
Material and interface decisions for processors, memory and high-density compute.
Advanced thermal materials
Diamond materials and precision components for thermal, optical and mechanical performance.

Spreads heat toward the next cooling layer.
Material, thickness and joining shape the thermal path.
The source of the heat—and the starting point for the design.
Materials & components
Explore the catalogue by product family.

Crystal forms and grades for your component.

Spread heat. Connect the cooling path.

Diamond forms for light, beams and spectroscopy.

Diamond for cutting, shaping and wear.

Diamond combined with a supporting matrix.

Connect diamond to the device and assembly.

Diamond for measurement and quantum research.

Conductive diamond for electrochemical systems.

Diamond forms for high-frequency audio.
Catalogue coverage
Material to application
One engineering perspective. Three application worlds.
Computing & Packaging
Material and interface decisions for processors, memory and high-density compute.
RF & Photonics
Heat-spreading components for high-frequency devices, optical systems and demanding environments.
Power & Precision
Connect the material, geometry and integration requirements of the complete assembly.
Technology
A considered route from crystal selection to a finished component.

Crystal type, grade and geometry.
Precision processing and surface engineering.
Joining requirements and inspection.
From requirement to review
Share your application, material requirement or drawing. We’ll define the next step together.