Diamond Composites Metal-matrix material
Aluminum–Diamond Composite
Diamond particles in an aluminium matrix, for thermal components.
Good to know
- Diamond fraction influences both thermal and expansion behaviour.
- The finished component needs a defined surface and joining condition.
- Performance must be evaluated for the actual composite formulation.
Specifications
What we define for aluminum–diamond composite, with units and how each is typically measured. We confirm values for your application in technical review.
Request the datasheetLook up a term in the glossaryDimensions & tolerances
| Parameter | Unit | Typical test method |
|---|---|---|
| Thickness and tolerance (bulk or layer) | mm | Micrometer or optical gauge |
| Lateral size, outline or diameter, and tolerance | mm | Optical measurement |
| Flatness or surface figure, and bow | µm or fringes | Interferometry (633 nm) or profilometry |
| Edge condition and chip limit | Microscopy inspection to drawing |
Surface & finish
| Parameter | Unit | Typical test method |
|---|---|---|
| Surface finish condition (as-grown, lapped or polished) | Visual inspection to drawing | |
| Surface roughness per side | nm Ra | Profilometry or AFM |
Material properties
| Parameter | Unit | Typical test method |
|---|---|---|
| Diamond fraction and matrix composition | vol % | Density calculation or microscopy |
| Thermal conductivity grade | W/m·K | Laser flash (ASTM E1461) |
| Coefficient of thermal expansion (per temperature range) | ppm/K | Thermomechanical analysis (ASTM E831) |
| Density | g/cm³ | Archimedes method |
| Thermal conductivity versus temperature | W/m·K | Laser flash over temperature (ASTM E1461) |
| Porosity and void content | % | Density comparison or acoustic microscopy |
| Young's modulus | GPa | Resonance method (ASTM E1876) |
Metallization & joining
| Parameter | Unit | Typical test method |
|---|---|---|
| Heat-cycle dimensional stability | cycles | Thermal-cycle test with post-test inspection |
| Metallization or plating stack and thickness | nm per layer | XRF or cross-section |
Integration & packaging
| Parameter | Unit | Typical test method |
|---|---|---|
| Certificate of conformance and traceability | Supplier declaration |
Where it is used
- Telecom, RF & RadarRF power raises junction temperature; diamond helps carry heat away while interfaces stay reliable.
- Power Electronics & EVsTemperature cycling demands expansion balance and isolation; diamond components help manage the heat.
- Aerospace & DefenceMass and harsh environments constrain thermal design; diamond offers a route for moving heat.
Requirement to review
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