Diamond Composites Metal-matrix material
Copper–Diamond Composite
Diamond particles in copper, developed for thermal components.
Good to know
- The matrix and diamond interface influence conductivity.
- Composite formulation affects expansion as well as heat transfer.
- A copper-based composite should not be treated as electrically insulating diamond.
Specifications
What we define for copper–diamond composite, with units and how each is typically measured. We confirm values for your application in technical review.
Request the datasheetLook up a term in the glossaryDimensions & tolerances
| Parameter | Unit | Typical test method |
|---|---|---|
| Thickness and tolerance (bulk or layer) | mm | Micrometer or optical gauge |
| Lateral size, outline or diameter, and tolerance | mm | Optical measurement |
| Flatness or surface figure, and bow | µm or fringes | Interferometry (633 nm) or profilometry |
| Edge condition and chip limit | Microscopy inspection to drawing |
Surface & finish
| Parameter | Unit | Typical test method |
|---|---|---|
| Surface roughness per side | nm Ra | Profilometry or AFM |
Material properties
| Parameter | Unit | Typical test method |
|---|---|---|
| Thermal conductivity grade | W/m·K | Laser flash (ASTM E1461) |
| Coefficient of thermal expansion (per temperature range) | ppm/K | Thermomechanical analysis (ASTM E831) |
| Diamond fraction and matrix composition | vol % | Density calculation or microscopy |
| Density | g/cm³ | Archimedes method |
| Thermal conductivity versus temperature | W/m·K | Laser flash over temperature (ASTM E1461) |
| Porosity and void content | % | Density comparison or acoustic microscopy |
Metallization & joining
| Parameter | Unit | Typical test method |
|---|---|---|
| Metallization or plating stack and thickness | nm per layer | XRF or cross-section |
| Heat-cycle dimensional stability | cycles | Thermal-cycle test with post-test inspection |
| Metal adhesion | N | Pull or scratch test |
| Solder or braze compatibility | Wetting and shear test |
Electrical & electrochemical
| Parameter | Unit | Typical test method |
|---|---|---|
| Electrical resistivity and test conditions | Ω·cm | Four-point probe |
Integration & packaging
| Parameter | Unit | Typical test method |
|---|---|---|
| Certificate of conformance and traceability | Supplier declaration |
Where it is used
- Telecom, RF & RadarRF power raises junction temperature; diamond helps carry heat away while interfaces stay reliable.
- Power Electronics & EVsTemperature cycling demands expansion balance and isolation; diamond components help manage the heat.
- Aerospace & DefenceMass and harsh environments constrain thermal design; diamond offers a route for moving heat.
Requirement to review
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Share your copper–diamond composite requirement, dimensions and drawing for review.