Diamond Composites Metal-matrix material
Silver–Diamond Composite
A silver matrix with diamond, aimed at balancing heat conduction and package expansion.
Good to know
- Composite properties differ from those of either constituent alone.
- Flatness and metallization affect integration into a package.
- The operating temperature range matters when comparing expansion data.
Specifications
What we define for silver–diamond composite, with units and how each is typically measured. We confirm values for your application in technical review.
Request the datasheetLook up a term in the glossaryDimensions & tolerances
| Parameter | Unit | Typical test method |
|---|---|---|
| Lateral size, outline or diameter, and tolerance | mm | Optical measurement |
| Thickness and tolerance (bulk or layer) | mm | Micrometer or optical gauge |
| Flatness or surface figure, and bow | µm or fringes | Interferometry (633 nm) or profilometry |
| Edge condition and chip limit | Microscopy inspection to drawing |
Surface & finish
| Parameter | Unit | Typical test method |
|---|---|---|
| Surface roughness per side | nm Ra | Profilometry or AFM |
Material properties
| Parameter | Unit | Typical test method |
|---|---|---|
| Thermal conductivity grade | W/m·K | Laser flash (ASTM E1461) |
| Coefficient of thermal expansion (per temperature range) | ppm/K | Thermomechanical analysis (ASTM E831) |
| Diamond fraction and matrix composition | vol % | Density calculation or microscopy |
| Density | g/cm³ | Archimedes method |
| Thermal conductivity versus temperature | W/m·K | Laser flash over temperature (ASTM E1461) |
| Porosity and void content | % | Density comparison or acoustic microscopy |
Metallization & joining
| Parameter | Unit | Typical test method |
|---|---|---|
| Metallization or plating stack and thickness | nm per layer | XRF or cross-section |
| Heat-cycle dimensional stability | cycles | Thermal-cycle test with post-test inspection |
| Solder or braze compatibility | Wetting and shear test |
Integration & packaging
| Parameter | Unit | Typical test method |
|---|---|---|
| Certificate of conformance and traceability | Supplier declaration |
Where it is used
- Telecom, RF & RadarRF power raises junction temperature; diamond helps carry heat away while interfaces stay reliable.
- Power Electronics & EVsTemperature cycling demands expansion balance and isolation; diamond components help manage the heat.
- Aerospace & DefenceMass and harsh environments constrain thermal design; diamond offers a route for moving heat.
Requirement to review
Have a material requirement? Let’s review it.
Share your silver–diamond composite requirement, dimensions and drawing for review.