Integrated & Bonded Substrates Bonded assemblies
Custom Bonded Diamond Assemblies
Diamond joined to another material as part of your device or thermal stack.
Good to know
- Surface preparation and flatness influence bond quality.
- The interface can govern thermal performance even with a highly conductive substrate.
- Acceptance criteria should distinguish bond strength, voids and thermal resistance.
Specifications
What we define for custom bonded diamond assemblies, with units and how each is typically measured. We confirm values for your application in technical review.
Request the datasheetLook up a term in the glossaryDimensions & tolerances
| Parameter | Unit | Typical test method |
|---|---|---|
| Lateral size, outline or diameter, and tolerance | mm | Optical measurement |
| Flatness or surface figure, and bow | µm or fringes | Interferometry (633 nm) or profilometry |
| Thickness and tolerance (bulk or layer) | mm | Micrometer or optical gauge |
| Edge condition and chip limit | Microscopy inspection to drawing |
Surface & finish
| Parameter | Unit | Typical test method |
|---|---|---|
| Surface roughness per side | nm Ra | Profilometry or AFM |
Material properties
| Parameter | Unit | Typical test method |
|---|---|---|
| Thermal conductivity grade | W/m·K | Laser flash (ASTM E1461) |
Metallization & joining
| Parameter | Unit | Typical test method |
|---|---|---|
| Layer sequence and thicknesses (including interlayers) | µm | Cross-section microscopy or per drawing |
| Bond integrity and bonded area | % | Acoustic microscopy |
| Process temperature budget and thermal cycling | °C | Thermal-cycle test with post-test inspection |
| Bonding method and interlayer | Supplier declaration | |
| Heat-cycle dimensional stability | cycles | Thermal-cycle test with post-test inspection |
Integration & packaging
| Parameter | Unit | Typical test method |
|---|---|---|
| Thermal boundary resistance | m²K/W | Time-domain thermoreflectance |
| Wafer bow and warp (including over temperature) | µm | Wafer geometry gauge or profilometry |
| Seal integrity and chemical compatibility | atm·cc/s | Helium leak test |
| Certificate of conformance and traceability | Supplier declaration |
Where it is used
- Computing & Data CentresDense heat and tight package space need a short path to cooling; diamond spreads it.
- Telecom, RF & RadarRF power raises junction temperature; diamond helps carry heat away while interfaces stay reliable.
- Power Electronics & EVsTemperature cycling demands expansion balance and isolation; diamond components help manage the heat.
- Semiconductor EquipmentProcessing demands precision, cleanliness and compatible materials; diamond parts are specified around all three.
Requirement to review
Have a material requirement? Let’s review it.
Share your custom bonded diamond assemblies requirement, dimensions and drawing for review.