Integrated & Bonded Substrates Copper-bonded substrates
Direct-Bonded Copper on Diamond
Copper bonded directly to diamond for thermal and electrical integration.
Good to know
- Copper layout must preserve the required insulating regions.
- Bond integrity and expansion mismatch matter during temperature cycling.
- The copper thickness and pattern must suit the intended current path.
Specifications
What we define for direct-bonded copper on diamond, with units and how each is typically measured. We confirm values for your application in technical review.
Request the datasheetLook up a term in the glossaryDimensions & tolerances
| Parameter | Unit | Typical test method |
|---|---|---|
| Lateral size, outline or diameter, and tolerance | mm | Optical measurement |
| Thickness and tolerance (bulk or layer) | mm | Micrometer or optical gauge |
| Flatness or surface figure, and bow | µm or fringes | Interferometry (633 nm) or profilometry |
Material properties
| Parameter | Unit | Typical test method |
|---|---|---|
| Coefficient of thermal expansion (per temperature range) | ppm/K | Thermomechanical analysis (ASTM E831) |
Metallization & joining
| Parameter | Unit | Typical test method |
|---|---|---|
| Metallization pattern and coverage | Optical inspection to drawing | |
| Metallization or plating stack and thickness | nm per layer | XRF or cross-section |
| Bond integrity and bonded area | % | Acoustic microscopy |
| Process temperature budget and thermal cycling | °C | Thermal-cycle test with post-test inspection |
| Metal adhesion | N | Pull or scratch test |
| Solder or braze compatibility | Wetting and shear test | |
| Wire-bond and die-attach compatibility | Bond-pull and die-shear test | |
| Heat-cycle dimensional stability | cycles | Thermal-cycle test with post-test inspection |
Electrical & electrochemical
| Parameter | Unit | Typical test method |
|---|---|---|
| Electrical isolation | Ω | Insulation-resistance test |
Integration & packaging
| Parameter | Unit | Typical test method |
|---|---|---|
| Thermal boundary resistance | m²K/W | Time-domain thermoreflectance |
| Certificate of conformance and traceability | Supplier declaration |
Where it is used
- Computing & Data CentresDense heat and tight package space need a short path to cooling; diamond spreads it.
- Telecom, RF & RadarRF power raises junction temperature; diamond helps carry heat away while interfaces stay reliable.
- Power Electronics & EVsTemperature cycling demands expansion balance and isolation; diamond components help manage the heat.
- Semiconductor EquipmentProcessing demands precision, cleanliness and compatible materials; diamond parts are specified around all three.
Requirement to review
Have a material requirement? Let’s review it.
Share your direct-bonded copper on diamond requirement, dimensions and drawing for review.