Integrated & Bonded Substrates Expansion-managed stacks
Strain-Balanced Diamond Substrates
Layered substrates arranged to manage deformation caused by thermal expansion.
Good to know
- Layer materials, thicknesses and symmetry influence strain balance.
- Warpage must be evaluated over the relevant temperature range.
- A named architecture does not establish suitability for every package.
Specifications
What we define for strain-balanced diamond substrates, with units and how each is typically measured. We confirm values for your application in technical review.
Request the datasheetLook up a term in the glossaryDimensions & tolerances
| Parameter | Unit | Typical test method |
|---|---|---|
| Flatness or surface figure, and bow | µm or fringes | Interferometry (633 nm) or profilometry |
| Lateral size, outline or diameter, and tolerance | mm | Optical measurement |
| Thickness and tolerance (bulk or layer) | mm | Micrometer or optical gauge |
| Thickness uniformity (total thickness variation) | µm | Thickness mapping or interferometry |
| Edge condition and chip limit | Microscopy inspection to drawing |
Surface & finish
| Parameter | Unit | Typical test method |
|---|---|---|
| Surface roughness per side | nm Ra | Profilometry or AFM |
Material properties
| Parameter | Unit | Typical test method |
|---|---|---|
| Coefficient of thermal expansion (per temperature range) | ppm/K | Thermomechanical analysis (ASTM E831) |
| Residual stress | MPa | Raman spectroscopy or wafer-curvature method |
| Thermal conductivity grade | W/m·K | Laser flash (ASTM E1461) |
Metallization & joining
| Parameter | Unit | Typical test method |
|---|---|---|
| Layer sequence and thicknesses (including interlayers) | µm | Cross-section microscopy or per drawing |
| Bond integrity and bonded area | % | Acoustic microscopy |
| Process temperature budget and thermal cycling | °C | Thermal-cycle test with post-test inspection |
| Heat-cycle dimensional stability | cycles | Thermal-cycle test with post-test inspection |
Integration & packaging
| Parameter | Unit | Typical test method |
|---|---|---|
| Wafer bow and warp (including over temperature) | µm | Wafer geometry gauge or profilometry |
| Certificate of conformance and traceability | Supplier declaration |
Where it is used
- Computing & Data CentresDense heat and tight package space need a short path to cooling; diamond spreads it.
- Telecom, RF & RadarRF power raises junction temperature; diamond helps carry heat away while interfaces stay reliable.
- Power Electronics & EVsTemperature cycling demands expansion balance and isolation; diamond components help manage the heat.
- Semiconductor EquipmentProcessing demands precision, cleanliness and compatible materials; diamond parts are specified around all three.
Requirement to review
Have a material requirement? Let’s review it.
Share your strain-balanced diamond substrates requirement, dimensions and drawing for review.