Integrated & Bonded Substrates Vertical interconnects
Through-Diamond Via Substrates
Diamond substrates with through-thickness features for an integrated package.
Good to know
- A drilled opening and a conductive interconnect are different deliverables.
- Via geometry and metallization define the electrical path.
- Isolation from neighbouring contacts must be included in the layout.
Specifications
What we define for through-diamond via substrates, with units and how each is typically measured. We confirm values for your application in technical review.
Request the datasheetLook up a term in the glossaryDimensions & tolerances
| Parameter | Unit | Typical test method |
|---|---|---|
| Via diameter and pitch | µm | Optical microscopy |
| Thickness and tolerance (bulk or layer) | mm | Micrometer or optical gauge |
| Lateral size, outline or diameter, and tolerance | mm | Optical measurement |
| Flatness or surface figure, and bow | µm or fringes | Interferometry (633 nm) or profilometry |
| Edge condition and chip limit | Microscopy inspection to drawing |
Surface & finish
| Parameter | Unit | Typical test method |
|---|---|---|
| Surface roughness per side | nm Ra | Profilometry or AFM |
Material properties
| Parameter | Unit | Typical test method |
|---|---|---|
| Thermal conductivity grade | W/m·K | Laser flash (ASTM E1461) |
Metallization & joining
| Parameter | Unit | Typical test method |
|---|---|---|
| Metallization or plating stack and thickness | nm per layer | XRF or cross-section |
| Metallization pattern and coverage | Optical inspection to drawing | |
| Metal adhesion | N | Pull or scratch test |
| Heat-cycle dimensional stability | cycles | Thermal-cycle test with post-test inspection |
Electrical & electrochemical
| Parameter | Unit | Typical test method |
|---|---|---|
| Electrical isolation | Ω | Insulation-resistance test |
| Via resistance | mΩ | Four-point probe |
Integration & packaging
| Parameter | Unit | Typical test method |
|---|---|---|
| Seal integrity and chemical compatibility | atm·cc/s | Helium leak test |
| Certificate of conformance and traceability | Supplier declaration |
Where it is used
- Computing & Data CentresDense heat and tight package space need a short path to cooling; diamond spreads it.
- Telecom, RF & RadarRF power raises junction temperature; diamond helps carry heat away while interfaces stay reliable.
- Power Electronics & EVsTemperature cycling demands expansion balance and isolation; diamond components help manage the heat.
- Semiconductor EquipmentProcessing demands precision, cleanliness and compatible materials; diamond parts are specified around all three.
Requirement to review
Have a material requirement? Let’s review it.
Share your through-diamond via substrates requirement, dimensions and drawing for review.