Thermal Components Device support plates
Diamond Chip Substrates
Sits beneath a die to support it mechanically and spread its heat.
Good to know
- Undoped diamond and conductive surface layers play different electrical roles.
- The die-attach layer contributes to total thermal resistance.
- Electrical isolation must be evaluated across the finished stack.
Specifications
What we define for diamond chip substrates, with units and how each is typically measured. We confirm values for your application in technical review.
Request the datasheetLook up a term in the glossaryDimensions & tolerances
| Parameter | Unit | Typical test method |
|---|---|---|
| Lateral size, outline or diameter, and tolerance | mm | Optical measurement |
| Thickness and tolerance (bulk or layer) | mm | Micrometer or optical gauge |
| Flatness or surface figure, and bow | µm or fringes | Interferometry (633 nm) or profilometry |
| Edge condition and chip limit | Microscopy inspection to drawing |
Surface & finish
| Parameter | Unit | Typical test method |
|---|---|---|
| Surface roughness per side | nm Ra | Profilometry or AFM |
Material properties
| Parameter | Unit | Typical test method |
|---|---|---|
| Thermal conductivity grade | W/m·K | Laser flash (ASTM E1461) |
| Coefficient of thermal expansion (per temperature range) | ppm/K | Thermomechanical analysis (ASTM E831) |
Metallization & joining
| Parameter | Unit | Typical test method |
|---|---|---|
| Metallization pattern and coverage | Optical inspection to drawing | |
| Metallization or plating stack and thickness | nm per layer | XRF or cross-section |
| Metal adhesion | N | Pull or scratch test |
| Wire-bond and die-attach compatibility | Bond-pull and die-shear test |
Electrical & electrochemical
| Parameter | Unit | Typical test method |
|---|---|---|
| Electrical isolation | Ω | Insulation-resistance test |
| Dielectric constant and loss tangent | Resonant-cavity measurement | |
| Dielectric breakdown strength | kV/mm | Dielectric strength test |
Integration & packaging
| Parameter | Unit | Typical test method |
|---|---|---|
| Operating temperature limit | °C | Per application brief |
| Certificate of conformance and traceability | Supplier declaration |
Where it is used
- Computing & Data CentresDense heat and tight package space need a short path to cooling; diamond spreads it.
- Telecom, RF & RadarRF power raises junction temperature; diamond helps carry heat away while interfaces stay reliable.
- Power Electronics & EVsTemperature cycling demands expansion balance and isolation; diamond components help manage the heat.
- Lasers & PhotonicsOptics must transmit light and survive heat load; diamond transmits and conducts heat away.
Requirement to review
Have a material requirement? Let’s review it.
Share your diamond chip substrates requirement, dimensions and drawing for review.