Thermal Components Thermal components
Diamond Heat Sinks
Carries heat from your device toward the cooling assembly.
Good to know
- A diamond component does not remove the need for a downstream cooling path.
- Thickness and contact geometry affect both heat flow and mechanical support.
- The assembly should be evaluated under its actual power and temperature conditions.
Specifications
What we define for diamond heat sinks, with units and how each is typically measured. We confirm values for your application in technical review.
Request the datasheetLook up a term in the glossaryDimensions & tolerances
| Parameter | Unit | Typical test method |
|---|---|---|
| Lateral size, outline or diameter, and tolerance | mm | Optical measurement |
| Thickness and tolerance (bulk or layer) | mm | Micrometer or optical gauge |
| Flatness or surface figure, and bow | µm or fringes | Interferometry (633 nm) or profilometry |
| Edge chamfer or radius | mm | Optical comparator |
| Edge condition and chip limit | Microscopy inspection to drawing |
Surface & finish
| Parameter | Unit | Typical test method |
|---|---|---|
| Surface finish condition (as-grown, lapped or polished) | Visual inspection to drawing |
Material properties
| Parameter | Unit | Typical test method |
|---|---|---|
| Thermal conductivity grade | W/m·K | Laser flash (ASTM E1461) |
| Coefficient of thermal expansion (per temperature range) | ppm/K | Thermomechanical analysis (ASTM E831) |
Metallization & joining
| Parameter | Unit | Typical test method |
|---|---|---|
| Metallization or plating stack and thickness | nm per layer | XRF or cross-section |
| Solder or braze compatibility | Wetting and shear test |
Integration & packaging
| Parameter | Unit | Typical test method |
|---|---|---|
| Heat load or beam power | W | Application thermal analysis |
| Operating load, medium and environment | Per application brief | |
| Thermal boundary resistance | m²K/W | Time-domain thermoreflectance |
| Operating temperature limit | °C | Per application brief |
| Certificate of conformance and traceability | Supplier declaration |
Where it is used
- Computing & Data CentresDense heat and tight package space need a short path to cooling; diamond spreads it.
- Telecom, RF & RadarRF power raises junction temperature; diamond helps carry heat away while interfaces stay reliable.
- Power Electronics & EVsTemperature cycling demands expansion balance and isolation; diamond components help manage the heat.
- Lasers & PhotonicsOptics must transmit light and survive heat load; diamond transmits and conducts heat away.
Requirement to review
Have a material requirement? Let’s review it.
Share your diamond heat sinks requirement, dimensions and drawing for review.