Thermal Components Local thermal inserts
Diamond Thermal Coins & Inserts
A small diamond insert that gives a package one local path for heat.
Good to know
- The insert geometry must fit the surrounding host material.
- A flush contact surface and controlled bond line matter at both ends.
- Expansion mismatch needs consideration across the assembly temperature range.
Specifications
What we define for diamond thermal coins & inserts, with units and how each is typically measured. We confirm values for your application in technical review.
Request the datasheetLook up a term in the glossaryDimensions & tolerances
| Parameter | Unit | Typical test method |
|---|---|---|
| Profile, curvature or focal length | mm | Contact or optical profilometry |
| Thickness and tolerance (bulk or layer) | mm | Micrometer or optical gauge |
| Lateral size, outline or diameter, and tolerance | mm | Optical measurement |
| Flatness or surface figure, and bow | µm or fringes | Interferometry (633 nm) or profilometry |
| Edge chamfer or radius | mm | Optical comparator |
| Drawing dimensions and tolerances | mm | CMM or optical measurement to drawing |
Surface & finish
| Parameter | Unit | Typical test method |
|---|---|---|
| Surface roughness per side | nm Ra | Profilometry or AFM |
Material properties
| Parameter | Unit | Typical test method |
|---|---|---|
| Thermal conductivity grade | W/m·K | Laser flash (ASTM E1461) |
| Coefficient of thermal expansion (per temperature range) | ppm/K | Thermomechanical analysis (ASTM E831) |
Metallization & joining
| Parameter | Unit | Typical test method |
|---|---|---|
| Solder or braze compatibility | Wetting and shear test | |
| Metallization or plating stack and thickness | nm per layer | XRF or cross-section |
| Metal adhesion | N | Pull or scratch test |
Integration & packaging
| Parameter | Unit | Typical test method |
|---|---|---|
| Mounting interface, host fit and attachment | Per drawing | |
| Operating temperature limit | °C | Per application brief |
| Certificate of conformance and traceability | Supplier declaration | |
| Packaging, cleanliness and labelling | Per drawing |
Where it is used
- Computing & Data CentresDense heat and tight package space need a short path to cooling; diamond spreads it.
- Telecom, RF & RadarRF power raises junction temperature; diamond helps carry heat away while interfaces stay reliable.
- Power Electronics & EVsTemperature cycling demands expansion balance and isolation; diamond components help manage the heat.
- Lasers & PhotonicsOptics must transmit light and survive heat load; diamond transmits and conducts heat away.
Requirement to review
Have a material requirement? Let’s review it.
Share your diamond thermal coins & inserts requirement, dimensions and drawing for review.