Thermal Components Thermal plates
Diamond Heat Spreaders
Draws heat from a concentrated source and spreads it toward a larger cooling interface.
Good to know
- Spreading performance depends on plate thickness and source footprint.
- Contact resistance can limit the benefit of a high-conductivity material.
- Bare and metallized contact faces require different joining arrangements.
Specifications
What we define for diamond heat spreaders, with units and how each is typically measured. We confirm values for your application in technical review.
Request the datasheetLook up a term in the glossaryDimensions & tolerances
| Parameter | Unit | Typical test method |
|---|---|---|
| Lateral size, outline or diameter, and tolerance | mm | Optical measurement |
| Thickness and tolerance (bulk or layer) | mm | Micrometer or optical gauge |
| Flatness or surface figure, and bow | µm or fringes | Interferometry (633 nm) or profilometry |
| Thickness uniformity (total thickness variation) | µm | Thickness mapping or interferometry |
| Edge condition and chip limit | Microscopy inspection to drawing |
Surface & finish
| Parameter | Unit | Typical test method |
|---|---|---|
| Surface roughness per side | nm Ra | Profilometry or AFM |
| Surface finish condition (as-grown, lapped or polished) | Visual inspection to drawing |
Material properties
| Parameter | Unit | Typical test method |
|---|---|---|
| Thermal conductivity grade | W/m·K | Laser flash (ASTM E1461) |
| Coefficient of thermal expansion (per temperature range) | ppm/K | Thermomechanical analysis (ASTM E831) |
| Thermal conductivity versus temperature | W/m·K | Laser flash over temperature (ASTM E1461) |
Metallization & joining
| Parameter | Unit | Typical test method |
|---|---|---|
| Metallization or plating stack and thickness | nm per layer | XRF or cross-section |
| Metal adhesion | N | Pull or scratch test |
| Solder or braze compatibility | Wetting and shear test |
Integration & packaging
| Parameter | Unit | Typical test method |
|---|---|---|
| Packaging, cleanliness and labelling | Per drawing | |
| Certificate of conformance and traceability | Supplier declaration | |
| Operating temperature limit | °C | Per application brief |
Where it is used
- Computing & Data CentresDense heat and tight package space need a short path to cooling; diamond spreads it.
- Telecom, RF & RadarRF power raises junction temperature; diamond helps carry heat away while interfaces stay reliable.
- Power Electronics & EVsTemperature cycling demands expansion balance and isolation; diamond components help manage the heat.
- Lasers & PhotonicsOptics must transmit light and survive heat load; diamond transmits and conducts heat away.
Requirement to review
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