Thermal Components Laser mounting plates
Diamond Laser Submounts
Supports your laser element while giving its heat a way out.
Good to know
- Contact flatness and mounting geometry influence thermal contact.
- A disk-laser mount may require a defined curved contact surface.
- Metallization and joining layers must suit the laser assembly.
Specifications
What we define for diamond laser submounts, with units and how each is typically measured. We confirm values for your application in technical review.
Request the datasheetLook up a term in the glossaryDimensions & tolerances
| Parameter | Unit | Typical test method |
|---|---|---|
| Lateral size, outline or diameter, and tolerance | mm | Optical measurement |
| Flatness or surface figure, and bow | µm or fringes | Interferometry (633 nm) or profilometry |
| Profile, curvature or focal length | mm | Contact or optical profilometry |
| Thickness and tolerance (bulk or layer) | mm | Micrometer or optical gauge |
| Edge condition and chip limit | Microscopy inspection to drawing | |
| Parallelism or wedge | arcmin | Autocollimator or interferometry |
Surface & finish
| Parameter | Unit | Typical test method |
|---|---|---|
| Surface roughness per side | nm Ra | Profilometry or AFM |
Material properties
| Parameter | Unit | Typical test method |
|---|---|---|
| Thermal conductivity grade | W/m·K | Laser flash (ASTM E1461) |
| Coefficient of thermal expansion (per temperature range) | ppm/K | Thermomechanical analysis (ASTM E831) |
Metallization & joining
| Parameter | Unit | Typical test method |
|---|---|---|
| Metallization or plating stack and thickness | nm per layer | XRF or cross-section |
| Metal adhesion | N | Pull or scratch test |
| Solder or braze compatibility | Wetting and shear test | |
| Wire-bond and die-attach compatibility | Bond-pull and die-shear test |
Integration & packaging
| Parameter | Unit | Typical test method |
|---|---|---|
| Mounting interface, host fit and attachment | Per drawing | |
| Operating temperature limit | °C | Per application brief |
| Certificate of conformance and traceability | Supplier declaration |
Where it is used
- Computing & Data CentresDense heat and tight package space need a short path to cooling; diamond spreads it.
- Telecom, RF & RadarRF power raises junction temperature; diamond helps carry heat away while interfaces stay reliable.
- Power Electronics & EVsTemperature cycling demands expansion balance and isolation; diamond components help manage the heat.
- Lasers & PhotonicsOptics must transmit light and survive heat load; diamond transmits and conducts heat away.
Requirement to review
Have a material requirement? Let’s review it.
Share your diamond laser submounts requirement, dimensions and drawing for review.